市場データ 2026年6月1回目 （毎月10日、25日更新予定）最新動向・統計資料など

JEITA（電子情報技術産業協会）

・WSTS 2026年春季半導体市場予測について　20260602WSTS.pdf

・G7加盟国のデジタル業界団体（TECH7）が共同文書を公表　0529.pdf

・2026年3月電子材料生産実績　電子材料生産実績 | JEITA 電子部品部会

・2026年3月電子部品グローバル出荷統計　電子部品グローバル出荷統計 | JEITA 電子部品部会

・2026年3月電子工業生産実績表　日本の電子工業の生産・輸出・輸入

・2026年3月民生用電子機器国内出荷統計　民生用電子機器国内出荷統計

SEAJ

・半導体製造装置（日本製）、FPD製造装置（日本製）2026年4月度

　統計資料｜一般社団法人 日本半導体製造装置協会　（今月は世界統計も更新）

JMTBA

・2026年4月工作機械主要統計　Web用統計一般260525.xlsx

semi

・半導体製造装置の2026年第1四半期世界総販売額は前年同期比14%増 | SEMI

・エッジAIが支えるスマートでレジリエントな半導体製造 | SEMI

IDC　※今期より調査資料の有料化が加速したため、今後はトピックスがあった際に掲載します

・China Enterprise AI Spending Leads the Supercycle

TrendForce

・SpaceX IPO Momentum to Drive Global Satellite Industry Output Value to $447 Billion by 2027, as Taiwanese Firms Target Satellite Communications and AI Space Computing Opportunities, Says TrendForce

・NVIDIA Joins the Windows on Arm Ecosystem, Driving Arm-Based AI Notebook Penetration to 34.2% by 2029, Says TrendForce

・AI Data Center Expansion to Drive Combined Monthly Capacity of EML and CW-DFB LDs to 50.7 Million Units in 2026, Says TrendForce

・Tight DRAM Supply Gives Suppliers Greater Pricing Power in HBM, with HBM Contract Prices Expected to Surge Multiples Higher in 2027, Says TrendForce

・Rapid Contract Price Surge Drives 1Q26 DRAM Industry Up 81% QoQ, Says TrendForce

・Agentic AI Drives Structural Expansion in Memory Demand, Global Memory Market Projected to Reach US$1.28 Trillion by 2027, Says TrendForce

・Global NEV Sales Fell by 2% YoY for 1Q26 as Tesla Reclaimed BEV Sales Lead, Says TrendForce

・Micron’s Fab 6 Starts LPDDR4 and DDR4 Production, but DDR4 Shortage Is Expected to Persist, Says TrendForce

Counterpoint

・Apple has shipped over 450 million Apple Intelligence-capable iPhones

・Google Fuels up SpaceX’s IPO Rocket

・Global Pure Foundry Market Share: Quarterly

・Global XR (AR & VR Headsets) Market Share: Quarterly

・HONOR Magic V6 – First Impressions

・Top 5 Smartphone Models Share For 8 Countries

・Project Solara: Microsoft's Bet on Agent-First Enterprise Hardware

・COMPUTEX Taipei 2026: ‘AI Together’ – Agentic AI Takes Centre Stage

・Huawei’s Pura X Max Indicates Strong Early Demand for Wide Book-type Foldables in China

・Global NAND Memory Market Surges to a Record $46B in Q1 2026 as AI Demand Drives Massive Growth

・Apple M5 Pro Chip Teardown Analysis: Apple Silicon Chiplet Era Beckons 

・2026 Smartphone Shipments to Post Worst Annual Decline on Record as Memory Crisis and Geopolitical Shocks Converge

・Global LLM Adoption Snapshot, April 2026

・"AI Without Limits": How MediaTek is Powering the Agentic AI Era from Edge to Cloud

・Computex 2026: Agentic AI & Physical AI Reshaping the Computing Landscape

・HERE Retains Lead as Competition Intensifies, TomTom, Google and Mapbox also Recognized as Leaders in Counterpoint Research’s 2026 Location Platform Effectiveness Index

・Q1 2026 TV Market Outlook: How a Hisense-LG Deal Would Reshape Global Competition Dominated by Samsung & TCL

・Apple iPhone Market Share

・Global Electric Vehicle Market Share: Quarterly

・Global DRAM Revenue Surges to Near $100-billion Mark in Q1 2026 Driven by AI Data Center Boom

・Global Smartwatch Shipments Market Share: Quarterly

・Global Smartphone Sales Share by Operating System

・Astera Labs Ships Scorpio-X Scale-Up Switch, Predicts Continued Strong Growth

・FPD Industry Analysis Seminar - 2026 First Half Edition

・US Smartphone Market Share: Quarterly

Omdia

・Latest Omdia ProAV research reveals continued growth in signage displays despite wider market weakness

・Omdia: OLED display demand for notebook PCs to reach $11.5 billion by 2033

・Omdia: TV shipments increase 6% in 1Q26 as 2026 World Cup inventory build-up begins

・Omdia: AI Factory market enters industrialization era as five dynamics redefine AI infrastructure in 2026