4/11 新製品情報（電子部品・半導体）

・MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform

・TDK、EVサーマルシステムの効率を高める初の組み込みゲートドライバを開発 | TDK-Micronas GmbH

・Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection | Nexperia

・Why Flip-Chip LGA is a Game Changer for RF ESD Protection | Efficiency Wins

・The Future of ESD Protection: Unveiling the Benefits of Single Ended S-Parameter for Flip Chip LGA Solutions | Efficiency Wins